Dutch semiconductor firm Nexperia is now providing a portfolio of 16 new low VF optimized planar Schottky diodes in CFP2-HP packaging.
The portfolio consists of eight industrial (e.g. PMEG6010EXD), in addition to eight automotive AEC-Q101 certified (e.g. PMEG4010EXD-Q) merchandise. The discharge helps the rising development for producers to switch units in SMA/B/C kind packaging with smaller footprint CFP-packaged units, particularly in automotive purposes, based on the corporate. The diodes are appropriate to be used in DC-DC conversion, freewheeling, reverse polarity safety and different purposes.
For optimum design flexibility, the portfolio extension provides reverse voltages VR(max) starting from 20 V to 60 V and ahead currents IF(common) of 1 A and a couple of A. The uncovered heatsink of the CFP2-HP allows the very best stage of warmth dissipation (Ptot) at a small bundle footprint. The CFP2-HP bundle dimensions are 2.65 mm x 1.3 mm x 0.68 mm, together with leads.
Utilizing a copper clip design, the packages intention to fulfill the difficult calls for of environment friendly and space-saving designs. Nexperia’s Schottky and Restoration Rectifier Diodes use CFP packaging and it’ll quickly prolong them to bipolar transistors. Nexperia can also be releasing a low IR optimized portfolio of planar Schottky diodes for automotive and industrial purposes.
“Because the trade transitions to multi-layer PCBs, a development pushed by the rising recognition of high-performance microcontrollers, packaging turns into an important a part of the thermal system,” mentioned Frank Matschullat, Product Group Supervisor Energy Bipolar Discretes at Nexperia. “Fashionable CFP packaging know-how, designed for multilayer PCBs, provides equal electrical efficiency on a smaller footprint, lowering half and system prices.”
Supply: Nexperia
