Saturday, August 30, 2025

Charged EVs | Webinar: A comparability of module sintering vs. soldering—finest efficiency vs. finest value

SiC chips have revolutionized not solely the efficiency of energy modules but additionally the encompassing packaging applied sciences. Chips are now not soldered however sintered, die prime connections are now not Aluminum wires however Cu wires on die prime techniques or Cu clips. So, what’s the subsequent stage module connection? Sintering with giant space silver sinter paste for finest efficiency or soldering with excessive reliability solder preforms for finest value?

On this webinar, we examine soldering with Innolot preforms to sintering with PE360P, our silver sinter paste designed for printing, and spotlight the advantages and downsides of every method.

Clearly, the preforms win on the worth, utility is easy through choose and place course of from a waffle pack and are pre-cut to match the substrate design. The solder melts at 218°C and requires flux or formic acid for the soldering to work correctly. No strain is required. It exhibits glorious reliability for thermal biking from -40°C to +125°C, i.e. lower than 3% after 2000 cycles in comparison with over 15% for SAC. Nevertheless, for thermal shock testing from -50°C to +150°C it exhibits substantial (> 40%) delamination after 500 cycles.

That is the place large-area sintering is available in. It exhibits solely slight (< 3%) delamination after 500 cycles of temperature shock and only in the very corners of the substrate. It is applied by stencil printing but requires 5 minutes of 12 MPa pressure at 230°C for sintering. It is also significantly more expensive due to its 87% silver content, compared to only 3.8% for the IL preforms. However, the higher reliability and higher thermal conductivity (sintered silver is at > 200 W/mK whereas solder supplies are < 65 W/mK), the ensuing improved thermal resistance could nicely make it price it for top energy modules

Be part of this webinar at our September Digital Convention on EV Engineering, offered by Heraeus, to be taught extra a few comparability of module sintering versus soldering.

September 18, 2025, 10:15 am EDT
Register now—it’s free!


See the entire session record for the Digital Convention on EV Engineering right here.

Broadcast dwell from September 15 to 18, 2025, the convention content material will embody all the EV engineering provide chain and ecosystem, together with motor and energy electronics design and manufacturing, cell improvement, battery techniques, testing, powertrains, thermal administration, circuit safety, wire and cable, EMI/EMC and extra.


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