Residue-free pastes present tackiness and printability, and don’t depart residues behind after reflow. The benefit is a noticeable price saving, as there isn’t any want to scrub the substrates after soldering.
Residue-free pastes don’t comprise any activators. Due to this fact, formic acid have to be used to deoxidize the solder powder and the interconnect surfaces for profitable soldering. Residue-free pastes additionally launch considerably extra volatiles than resin-based solder pastes, which require particular dealing with of the volatiles within the oven, e.g., to keep away from frequent upkeep.
Be part of this webinar at subsequent week’s Digital Convention, introduced by PINK GmbH Thermosysteme, the place we are going to talk about the properties of residue-free pastes and technical options for vacuum reflow gear.
September 16, 2025, 9:30 am EDT
Register now—it’s free!
See the entire session listing for the Digital Convention on EV Engineering right here.
Broadcast reside from September 15 to 18, 2025, the convention content material will embody your entire EV engineering provide chain and ecosystem, together with motor and energy electronics design and manufacturing, cell improvement, battery programs, testing, powertrains, thermal administration, circuit safety, wire and cable, EMI/EMC and extra.
